Research Progress of Functional Graded Alloy Prepared by Additive Manufacturing Technology

doi:10.3901/JME.2021.22.184

Abstract

Abstract: As a key component of active phased array radar, the size and performance of T/R (Transmitter and Receiver) components determine the weight and function of the equipment. Wire bonding is one of the commonly used interconnection technologies in T/R components. With the improvement of component integration, it is necessary to develop corresponding high-density wire bonding technologies, which is essential for the miniaturization of bonding wires. However, ultra-fine leads will reduce the mechanical properties and reliability of the solder joints. Ultrasonic hot-press wedge bonding method is used to realize the connection of ultra-fine gold wire and gold pad, and the process parameters are optimized. The results show that with the increase of bonding pressure, bonding time and ultrasonic power, the wire deformation after bonding gradually increases, while the tension of the gold wire after bonding first increases and then decreases. And the influence of process parameters on the deformation of gold ribbon is less than that of gold wire. The excessive force of the second bonding point causes the lead deformation to be larger and the maximum tensile force is less than the first bonding point. Therefore, the number of bonding points needs to be increased. Finally, the best bonding process parameters of the gold wire and gold pad are obtained through the orthogonal experiment method. The bonding of ultra-fine size leads is realized, which is of great significance to the miniaturization of T/R components.

Key words: functional graded material, additive manufacturing, laser cladding, selective laser melting

CLC Number:

TG665

LI Qiqi, WEN Yaojie, ZHANG Baicheng, QU Xuanhui. Research Progress of Functional Graded Alloy Prepared by Additive Manufacturing Technology[J]. Journal of Mechanical Engineering, 2021, 57(22): 184-200.

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