[1] |
LI Ziqing, CUI Zhangcai, BIAN Subiao, LI Huihui, LU Jing, ORIOL Arteaga, XU Xipeng.
Non-destructive Measurement and Characterization of Damage Layer of Single-crystal Diamond Substrate after Ultra-precision Machining
[J]. Journal of Mechanical Engineering, 2024, 60(4): 239-249.
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[2] |
GUO Dongming, KANG Renke.
State-of-the-art and Prospectives of Ultra-precision Grinding Technology for Semiconductor Substrates
[J]. Journal of Mechanical Engineering, 2023, 59(19): 299-329.
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[3] |
ZHAO Yong, GUO Jiang, FENG Jian, WANG Qinqiang, LONG Pengyu, ZHANG Jinlong, ZHANG Linwei, WANG Shuo, MENG Linggang, JIN Zhuji, KANG Renke.
Recent Progress of Cleaning Technologies and Cleanliness Evaluation Methods for Metal Substrates
[J]. Journal of Mechanical Engineering, 2023, 59(13): 290-313.
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[4] |
Yi Chang, Ming Dong, Bin Wang, Ming Ren, Lihong Fan.
Review of Ex Vivo Cardiac Electrical Mapping and Intelligent Labeling of Atrial Fibrillation Substrates*
[J]. Chinese Journal of Electrical Engineering, 2023, 9(1): 93-103.
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[5] |
WANG Jingjing, LI Ling, SUN Litai, ZHANG Jinhua, CAI Anjiang.
Stiffness Model of Joint Surface Based on Coupling of Substrate Deformation and Asperity Interaction
[J]. Journal of Mechanical Engineering, 2022, 58(9): 190-199.
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[6] |
LIU Zhibin, QIAO Yuanyuan, ZHAO Ning.
Effect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints
[J]. Journal of Mechanical Engineering, 2022, 58(2): 269-275.
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[7] |
LI Ling, WANG Jingjing, PEI Xiyong, CHU Wei, CAI Anjiang.
A New Method for Modeling Mechanical Joint Surface Contact Stiffness
[J]. Journal of Mechanical Engineering, 2020, 56(9): 162-169.
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[8] |
YANGYi, DANG Mingzhu, LI Wei, WEI Qingsong.
Study on Cracking Mechanism and Inhibiting Process of TiAl Alloys Fabricated by Selective Laser Melting
[J]. Journal of Mechanical Engineering, 2020, 56(3): 181-188.
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[9] |
YIN Shaohui, WANG Yongqiang, LI Yepeng, KANG Renke, CHEN Fengjun, HU Tian.
Experimental Study on Magnetorheological Chemical Polishing for Sapphire Substrate
[J]. Journal of Mechanical Engineering, 2016, 52(5): 80-87.
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[10] |
YANG Yue;HE Cunfu;WU Bin.
Optimization of Microwave Detecting Thermal Barrier Coatings Using Coaxial Probe
[J]. , 2014, 50(2): 36-41.
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[11] |
XU Hong;WEN Donghui;OU Changjing.
Preparation of Ultra-smooth and Free-defect Copper Substrate for Amorphous Alloy Film
[J]. , 2014, 50(1): 162-168.
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[12] |
LI Shengyi;PENG Xiaoqiang.
Basic Theory and Method of Controllable Compliant Tools for Optic Elements Manufacturing
[J]. , 2013, 49(17): 1-9.
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[13] |
SHI Guangfeng;SHI Guoquan;XU Zhiwei;LIU Zhe;CAI Hongbin;ZHANG Baoqing.
Large Depth Nanoidentation Experiment of Echelle Grating Aluminum
[J]. , 2012, 48(20): 39-44.
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[14] |
LI Wenzhao;BIAN Xiufang.
Metallographic Study of Interface Achieved by Aluminum-iron Compound Casting
[J]. , 2011, 47(16): 67-72.
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[15] |
LONG Risheng;LIU Weijun;XING Fei;WANG Huabing;BIAN Hongyou.
Effects of Substrate Preheating on Thermal Stress during Laser Metal Deposition Shaping
[J]. , 2009, 45(10): 241-247.
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