Theoretical Analysis and Experimental Study on Material Removal Per Length of Wire in the Cutting of Multi-wire Saw with Reciprocating

doi:10.3901/JME.2018.13.208

Abstract

Abstract: Wire saw is widely used in wafers sawing in the photovoltaic and microelectronics industries, it also widely applied to cut other brittle materials. The quality of sawn wafer plays an important role in the subsequent machining process such as grinding and polishing. Theoretical models about reciprocating motion and feed motion of multi-wire saw are established, concept of material removal per length of wire is proposed, theoretical model about the material removal per length of wire versus cutting position are deduced. The influences of wire consumption length of a piece of wafer and feed speed ratio on the material removal per length of wire are analyzed theoretically. Sapphire ingot sawing experiments is carried out with various wire consumption lengths of a piece of wafer and feed rate ratios. The wafer qualities were measured. The experimental result showed that material removal per length of wire is different during the whole multi-wire sawing process. The material removal per length of wire is obviously influenced by the wire consumption length of a piece of wafer and feed rate ratio. The material removal per length of wire also had a significant effect on sawn quality.

Key words: feed rate ratio, material removal per length of wire, multi-wire saw, sawn quality, wire consumption length of a piece of wafer

CLC Number:

TH161

LIN Zhishu, HUANG Hui, ZHENG Shenglong. Theoretical Analysis and Experimental Study on Material Removal Per Length of Wire in the Cutting of Multi-wire Saw with Reciprocating[J]. Journal of Mechanical Engineering, 2018, 54(13): 208-214.

References

[1] HSU C Y, CHEN C S, TSAO C C. Free abrasive wire saw machining of ceramics[J]. International Joural of Advanced Manufacturing Technology, 2009, 40:503-511.
[2] GUIMARAES L, SANTOS R, LOBO B A. Scheduling wafer slicing by multi-wire saw manufacturing in photovoltaic industry:A case study[J]. International Joural of Advanced Manufacturing Technology, 2011, 53:1129-1139.
[3] CHEN K, LIU Y, WANG X, et al. Novel texturing process for diamond-wire-sawn single-crystalline silicon solar cell[J]. Solar Energy Materials and Solar Cells, 2015, 133:148-155.
[4] CHUNG C H, TSAY G D, TSAI M H. Distribution of diamond grains in fixed abrasive wire sawing process[J]. International Joural of Advanced Manufacturing Technology, 2014, 73:1485-1494.
[5] 张义兵,戴瑜兴,袁巨龙,等. 多线切割机线张力控制系统设计实现[J]. 机械工程学报, 2009, 45(5):295-300. ZHANG Yibing, DAI Yuxing, YUAN Julong, et al. Design and implement of wire tension control system for multi-wire saw[J]. Journal of Mechanical Engineering, 2009, 45(5):295-300.
[6] LIEDKE T, KUNA M. A macroscopic mechanical model of the wire sawing process[J]. Internatioal Joural of Machine Tools and Manufacture, 2011, 51(9):711-720.
[7] TEOMETE E. Investigation of long waviness induced by the wire saw process[J]. Proceedings of the Institution of Mechanical Engineers, Part B:Journal of Engineering Manufacture, 2011, 225(7):1153-1162.
[8] 王建臣,邓小雷,王涛. 硅片多线切割的温度场仿真研究[J]. 组合机床与自动化加工技术, 2013(9):32-38. WANG Jianchen, DENG Xiaolei, WANG Tao. Research on temperature distribution in silicon wafers slicing with wire saw[J]. Modular Machine Tool & Automatic Manufacturing Technique, 2013(9):32-38.
[9] 刘永,李淑娟,李言,等. 基于中心复合设计试验的SiC单晶片超声振动加工工艺参数优化[J]. 机械工程学报, 2013, 49(7):193-198. LIU Yong, LI Shujuan, LI Yan, et al. Central composite design test baed process parameters optimiaing for compound machining with ultrasonic vibration on SiC wafer[J]. Journal of Mechanical Engineering, 2013, 49(7):193-198.
[10] KIM H, KIM D, KIM C, et al. Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires[J]. CIRP Annals-Manufacturing Technology, 2013, 62(1):335-338.
[11] 郑生龙. 多线摇摆往复式线锯切割蓝宝石表面质量的试验研究[D]. 厦门:华侨大学, 2016. ZHENG Shenglong. Experimental research on sapphire surface quality sliced by multi-wire rocking sawing with reciprocating motion of diamond wires[D]. Xiamen:Huaqiao University, 2016.
[12] 孟剑峰. 环形电镀金刚石线锯加工技术与加工质量研究[D]. 济南:山东大学, 2006. MENG Jianfeng. Research on machined technology and machined quality of endless electroplated diamond wire saw[D]. Jinan:Shandong University, 2006.