Abstract: Based on the principle of sol-gel, a method is proposed to fabricate large size grinding and polishing tools containing fine abrasives. The effects in the dispersing of fine abrasives in bond matrix are compared for the gel-bonded abrasive tools and sintered metal-bonded abrasive tools. The gel-bonded tools are used for the grinding and polishing of silicon wafers and natural stone materials. It is found that the gel-bonded tools are superior to the sintered tools in dispersing fine abrasives. As compared to the sintered tools, much lower surface roughness can be obtained with high efficiency while grinding and polishing silicon wafers by the gel-bonded tools. But, the gel-bonded tools are poor in terms of material removal and surface gloss readings while machining of hard granite. When the gel-bonded tools are used for marble, however, satisfactory surface gloss readings can be obtained. During the initial period of machining, the gel-bonded tools fail mainly in the form of abrasion whereas a number of abrasives detach from the gel bond as the machining process proceeds.

Key words: Fine abrasive, Gel-bonded tool, Grinding and polishing, Silicon wafer, Stone