Abstract: In order to realize reuse-oriented disassembly of components from printed circuit boards(PCB) and develop PCB disassembly process and apparatus, it is necessary to analyze and evaluate the influences of various parameters on reusability and disassembly efficiency of components. Mainboards of scraped computers are taken as samples, experiments are performed with three kinds of removal forces and four kinds of heating parameters on a pilot disassembly apparatus under the conditions of hot air heating, and the disassembly efficiency of components is analyzed and the disassembled components are evaluated for reuse. The experiments show that it has a high components disassembly ratio (CDR) for SMDs and THDs with unclinched pins under three kinds of removal forces (contact impact, non-contact impact and vibration). To improve the components disassembly ratio of waste PCBs, the disassembly ratio of slot and connectors should be concentrated on. To improve the reusability ratio of disassembled components, the reusability of IC chips with more than 100 pins should be regarded mainly. In addition, the optimal level range of heating parameters is analyzed with the purpose of better disassembly ratio. The results also show that small impact potential energy is favorable to a high reusability. These experiments provide the basis for determining the reuse-oriented disassembly process of components and also for developing the disassembly apparatus.

Key words: Disassembly process, Resource recycling, Reuse, Waste printed circuit board