IMPEDANCE/ADMITTANCE MODEL OF ULTRASONIC TRANSDUCER SYSTEM IN THERMOSONIC BONDING

Abstract

Abstract: An impedance and admittance model of transducer system, which includes system features such as material, size, loss factor, resonance frequency, exciting electrical signal and different loads, is established by equivalent circuit method. For two different loads with/without bonding tool, the impedance and admittance of transducer system are calculated based on above model. The numerical computations show that, there are four axial vibration modes of transducer system in 100 kHz. Comparing to no-tool condition, each resonance frequency and its impedance increase when with bonding tool. The result of sweeping measurement by impedance analyzer and FEM model are used to verify the impedance/admittance model.

Key words: Equivalent circuit model, Impedance/admittance, Thermosonic bonding, Ultrasonic transducer

CLC Number:

TN14

LONG Zhili;WU Yunxin;HAN Lei;DUAN Jian;ZHONG Jue. IMPEDANCE/ADMITTANCE MODEL OF ULTRASONIC TRANSDUCER SYSTEM IN THERMOSONIC BONDING[J]. , 2007, 43(10): 14-19.

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IMPEDANCE/ADMITTANCE MODEL OF ULTRASONIC TRANSDUCER SYSTEM IN THERMOSONIC BONDING

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