BEHAVIOR OF OXIDE FILM AND ELIMINATION OF MICROVOID DURING VACUUM-FREE VIBRATION LIQUID PHASE DIFFUSION BONDING OF SiCp/ZL101A COMPOSITES

Abstract

Abstract: The elimination of void and oxide film removal mechanism is researched in vacuum-free vibration liquid phase diffusion bonding of SiCp/ZL101A composites. Experimental results show that effect of elimination of void and oxide film removal is remarkable in the condition of vibration. Moreover, elimination of void and oxide film removal is accelerated under existence of liquid state eutectic interlayer. The elimination of void and oxide film removing model under solid state and the one under the coexistence solid and liquid phase are successively developed on basis of the above results.

Key words: Aluminum matrix composites, Bonding, Oxide film, Vacuum-free, Vibration

CLC Number:

TG453+.9

Xu Huibin;Yan Jiuchun;Yang Shiqin. BEHAVIOR OF OXIDE FILM AND ELIMINATION OF MICROVOID DURING VACUUM-FREE VIBRATION LIQUID PHASE DIFFUSION BONDING OF SiCp/ZL101A COMPOSITES[J]. , 2005, 41(7): 152-157.

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BEHAVIOR OF OXIDE FILM AND ELIMINATION OF MICROVOID DURING VACUUM-FREE VIBRATION LIQUID PHASE DIFFUSION BONDING OF SiCp/ZL101A COMPOSITES

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