Abstract: A new grinding process using an abrasive laver which is formed by electrophoretic deposition in-process as a cutting tool is called electrophoresis grinding. By the studying of the features and the forming mechanism of the ultra fine abrasive layer, a self-feeding electrophoresis grinding process is introduced, in which the depth-feeding is realized by growing of the abrasive layer without the machine feeding in depth. Both theoretic analysis and experiment studying show that not only the roughness on the worked surface are significantly improved but also the cutting depth can be controlled in submicron by this method.

Key words: Electrophoresis, Grinding, Superfine abrasive