Nanometer-scale Thickness Photoresist Multiple Blade Coating Process Analysis

doi:10.3901/JME.260704

Abstract

Abstract: Photoresist films with nanometric thickness are widely applied in the field of micro-nanofabrication, particularly in semiconductor manufacturing and microelectronic device fabrication. Among various fabrication methods for photoresist films, the blade-coating technique has attracted considerable attention due to its simple equipment setup, high solution utilization rate, controllable coating process, and suitability for large or high-aspect-ratio substrates. However, single-pass blade-coating often fails to achieve the desired film thickness and uniformity. To address this issue, this study proposes a multiple-pass blade-coating approach to enhance coating quality. A series of single-variable experiments are carried out to compare the film thickness and non-uniformity under different coating passes, and COMSOL simulations are conducted to investigate how film thickness is gradually reduced and uniformity is improved during multiple passes. The results indicate that the photoresist film thickness decreases in an inverse-proportional manner with the increasing number of passes, and multiple-pass blade-coating further enhances film uniformity. This finding provides a novel strategy for optimizing the blade-coating process in photoresist film preparation.

Key words: nanometer thickness, photoresist film, multiple-blade coating

CLC Number:

TQ021

LI Yuze, YAN Ying, HE Tao, LI Han, LI Henan, WAN Jiaqi, FANG Zikeng, GUO Dongming. Nanometer-scale Thickness Photoresist Multiple Blade Coating Process Analysis[J]. Journal of Mechanical Engineering, 2026, 62(13): 410-417.

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URL: http://www.cjmenet.com.cn/EN/10.3901/JME.260704

http://www.cjmenet.com.cn/EN/Y2026/V62/I13/410

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