Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board

doi:10.3901/JME.2019.06.054

Abstract

Abstract: With the miniaturization and multifunction of electronic component, the interconnection reliability has attracted more and more attention. Individual component has been analyzed in previous works. However when it enters service, the deformation, the heat conduction and the load of printed circuit board (PCB) will make a difference to the reliability of solder joint. Traditional finite element analysis into the solder joint is based on the component itself, but it can improve the accuracy and effectiveness of reliability assess into the solder joint when changing the simulation object into the whole PCB. The multi-scale solder joints, components and PCB are modeled and analyzed using ANSYS finite element software. The residual strain and stress distribution of the solder joint after reflow process are analyzed. The dangerous positions of the solder joint are discussed and the fatigue lives of solder joints in different packages are calculated using modified Coffin-Manson model. Comparison between the board level and the component level results shows the necessity and irreplaceability of board level simulation and helps to perfect the finite element theory into the fatigue life of the solder joint.

Key words: board level simulation, fatigue life, finite element analysis, multi-scale simulation

CLC Number:

TG425

LI Yue, TIAN Yanhong, CONG Sen, ZHANG Weiwei. Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board[J]. Journal of Mechanical Engineering, 2019, 55(6): 54-60.

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