• CN:11-2187/TH
  • ISSN:0577-6686
强冲击条件下MEMS封装可靠性有限元分析
崔九征;孙博;冯强
Finite Element Analysis of MEMS Package under High Impact
CUI Jiuzheng;SUN Bo;FENG Qiang
. 2011, (24): 177 -185 .