湿式机械化学磨削单晶硅的软磨料砂轮及其磨削性能
张瑜, 康仁科, 高尚, 黄金星, 朱祥龙
Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding
ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong
机械工程学报
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2023, (3): 328
-336
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DOI: 10.3901/JME.2023.03.328
