残余应力对混合组装BGA热循环可靠性影响

田艳红;贺晓斌;杭春进

Influence of the Hybrid BGA Residual Stress after Reflow on the Thermal Cycling Reliability

TIAN Yanhong;HE Xiaobin;HANG Chunjin

. 2014, (2): 86 -91 .