SiCp/ZL101A复合材料非真空振动液相扩散焊下微观孔洞闭合及氧化膜行为

许惠斌;闫久春;杨士勤

BEHAVIOR OF OXIDE FILM AND ELIMINATION OF MICROVOID DURING VACUUM-FREE VIBRATION LIQUID PHASE DIFFUSION BONDING OF SiCp/ZL101A COMPOSITES

Xu Huibin;Yan Jiuchun;Yang Shiqin

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