基于阳极键合玻璃与铜的钎焊连接机理研究及其力学性能分析

doi:10.3901/JME.2024.02.140

机械工程学报 ›› 2024, Vol. 60 ›› Issue (2): 140-149.doi: 10.3901/JME.2024.02.140

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基于阳极键合玻璃与铜的钎焊连接机理研究及其力学性能分析

贾旭¹, 胡利方¹, 李子昊¹, 郑植¹, 刘伟¹, 张鹏²

1. 太原理工大学材料科学与工程学院太原 030024;
2. 太原理工大学机械与运载工程学院太原 030024

收稿日期:2023-01-12 修回日期:2023-09-16 出版日期:2024-01-20 发布日期:2024-04-09
通讯作者: 胡利方(通信作者)，男，1980年出生，副教授，硕士研究生导师。主要研究方向为异种材料连接。E-mail：hulifang@tyut.edu.cn
作者简介:贾旭，男，1995年出生，硕士研究生。主要研究方向为异种材料连接。E-mail：jiaxu0427@163.co
基金资助:
国家自然科学基金资助项目(51875387， 51905373)。

Study on the Brazing Mechanism and Mechanical Properties of Glass-Copper Joining Process Based on Anodic Bonding

JIA Xu¹, HU Lifang¹, LI Zihao¹, ZHENG Zhi¹, LIU Wei¹, ZHANG Peng²

1. College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024;
2. College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan 030024

Received:2023-01-12 Revised:2023-09-16 Online:2024-01-20 Published:2024-04-09

摘要/Abstract

摘要： 以铝箔作为中间层，采用Sn-9Zn-3Bi钎料通过阳极键合及钎焊工艺成功地实现了玻璃与铜片的连接。利用扫描电镜观察了玻璃-铝-钎料-铜接头的微观组织，分别讨论了钎焊温度和钎焊时间对连接过程的影响以及钎料和铝、铜的界面反应演化机制。研究发现玻璃-铝-钎料-铜的连接界面良好，玻璃表面阳极键合的铝箔随钎焊时间的增加逐渐被消耗，当钎焊温度为240 ℃，钎焊时间为15 min时铝箔消耗完毕。钎料与铜在240 ℃钎焊温度下随钎焊时间的延长依次出现Cu₅Zn₈和CuZn₅金属间化合物层，且随钎焊时间的延长Cu₅Zn₈金属间化合物层厚度逐渐增加，CuZn₅金属间化合物层由锯齿状逐渐变平缓。研究发现随钎焊温度升高，铝箔同样被逐渐消耗，界面处生成的金属间化合物层厚度也逐渐增加，且CuZn₅金属间化合物层锯齿状更加明显。通过剪切试验发现玻璃-铜接头的剪切强度随钎焊时间的延长呈先增加后降低的趋势，在钎焊时间为10 min时剪切强度具有最大值20.29 MPa，断裂发生在玻璃基体内部，说明玻璃与铜实现了可靠连接。

关键词: 阳极键合, 钎焊, 玻璃, 铝, 铜

Abstract: The bonding process of the glass and copper was successfully achieved by an anodic bonding and brazing process using Sn-9Zn-3Bi solder and an aluminum foil. The microstructure of the glass-Al-solder-Cu joint was observed by using a scanning electron microscope. The effect of brazing temperature and brazing time on the bonding process and the interfacial microstructure between solder and aluminum copper was studied, it had been found that the aluminium foil was gradually consumed with the increase of the brazing time. The aluminum foil was consumed completely in 15 min at 240 ℃. The Cu₅Zn₈ and CuZn₅ intermetallic compound layer was sequentially formed with the increment of the brazing time at 240 ℃, and the CuZn₅ intermetallic compound layer was gradually increased. The width of CuZn₅ intermetallic compound layer becomes uniform gradually. It was found that as the brazing temperature increased, the aluminium foil was also gradually consumed and the thickness of the intermetallic layer generated at the interface also gradually increases, and the jagged shape of the CuZn₅ intermetallic layer became more obvious. Through shear test, it has been found that the shear strength of the glass-Cu joint increased initially, then decreased, with a maximum of 20.29 MPa. The fracture occurred at the glass substrate, indicating the reliable bonding technology.

Key words: anodic bonding, brazing, glass, aluminum, copper&

中图分类号:

TB321

贾旭, 胡利方, 李子昊, 郑植, 刘伟, 张鹏. 基于阳极键合玻璃与铜的钎焊连接机理研究及其力学性能分析[J]. 机械工程学报, 2024, 60(2): 140-149.

JIA Xu, HU Lifang, LI Zihao, ZHENG Zhi, LIU Wei, ZHANG Peng. Study on the Brazing Mechanism and Mechanical Properties of Glass-Copper Joining Process Based on Anodic Bonding[J]. Journal of Mechanical Engineering, 2024, 60(2): 140-149.

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基于阳极键合玻璃与铜的钎焊连接机理研究及其力学性能分析

Study on the Brazing Mechanism and Mechanical Properties of Glass-Copper Joining Process Based on Anodic Bonding

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