SiCp/Al复合材料切削过程的颗粒损伤研究

doi:10.3901/JME.2023.15.366

机械工程学报 ›› 2023, Vol. 59 ›› Issue (15): 366-376.doi: 10.3901/JME.2023.15.366

• 制造工艺与装备 • 上一篇

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SiCp/Al复合材料切削过程的颗粒损伤研究

孙伟¹, 王培军¹, 陈俊云¹, 段春争²

1. 燕山大学机械工程学院秦皇岛 066004;
2. 大连理工大学机械工程学院大连 116024

收稿日期:2022-08-22 修回日期:2023-03-22 出版日期:2023-08-05 发布日期:2023-09-27
通讯作者: 陈俊云(通信作者),女,1983年出生,博士,教授,博士研究生导师。主要研究方向为新型超硬刀具制造、超精密车削。E-mail:sophiacjy@ysu.edu.cn
作者简介:孙伟,男,1988年出生,博士,讲师,硕士研究生导师。主要研究方向为金属基复合材料切削机理、难加工材料的超精密加工技术。E-mail:sunwei_ysu@ysu.edu.cn;段春争,男,1971年出生,博士,教授,博士研究生导师。主要研究方向为切削理论与技术、先进制造技术。E-mail:duancz@dlut.edu.cn
基金资助:
国家自然科学基金资助项目(51775083)

Research on Particle Damage during SiCp/Al Composite Machining

SUN Wei¹, WANG Peijun¹, CHEN Junyun¹, DUAN Chunzheng²

1. School of Mechanical Engineering, Yanshan University, Qinhuangdao 066004;
2. School of Mechanical Engineering, Dalian University of Technology, Dalian 116024

Received:2022-08-22 Revised:2023-03-22 Online:2023-08-05 Published:2023-09-27

摘要/Abstract

摘要： SiCp/Al复合材料动态去除过程中极易发生颗粒损伤,为避免或利用复合材料切削加工过程中的颗粒损伤现象,优化SiCp/Al复合材料切削加工,深入研究了SiCp/Al复合材料切削的颗粒损伤现象及其对切削加工的影响。首先,通过位错塞积理论和切屑根部微观观察,揭示了SiCp/Al复合材料切削的颗粒损伤机理,发现位错塞积引起的应力集中是导致界面脱粘的主因,颗粒断裂主要是由集中应力、刀刃挤压颗粒、局部颗粒聚集挤压以及颗粒连成网状结构引起;然后,基于考虑颗粒影响的动态本构模型、Eshelby等效夹杂理论、Weibull统计分布和刀刃-颗粒接触分析,建立了SiCp/Al复合材料切削的颗粒损伤度模型,并借助图像处理技术验证了模型的有效性;最后,根据颗粒损伤度预测结果,分析了颗粒损伤度对SiCp/Al复合材料切削加工的影响。结果显示,颗粒损伤度增大,会使切屑锯齿化程度增强,并严重降低已加工表面质量;颗粒损伤会显著影响颗粒强化效应,导致切削力随颗粒含量增大先升后降、随颗粒尺寸增大而降低。

关键词: SiCp/Al复合材料, 切削, 颗粒损伤, 机理, 理论建模

Abstract: Particle damage easily occurs during dynamic removal of SiCp/Al composites. To improve the machining of SiCp/Al composites, it is necessary to avoid or take advantage of the effect of particle damage on the machinability of composites. Therefore, the particle damage and its influence on the machinability are deeply investigated in cutting of SiCp/Al composites. Firstly, the particle damage mechanism is revealed based on the dislocation packing theory and the observation of chip root. The interfacial decohesion is mainly caused by the stress concentration due to the pile-up of dislocations. Particle breakage was induced by the stress concentration, the tool edge squeezing particle, the local extrusion of particles, and the formation of the rigid network of particles. Secondly, a model of particle damage for the cutting of SiCp/Al composite is established, based on the dynamic constitutive model with particle effects, Eshelby's theory, Weibull distribution and the analysis of edge-particle contact. Then, the model is verified with the image processing technology. Finally, according to the prediction results, the influence of particle damage on the machining of SiCp/Al composites is analyzed. The conclusions showed that the increase of particle damage led to the enhancement of the saw-tooth profile of chips, and the serious deterioration of the machined surface quality. Particle damage significantly affected the particle strengthening effect, causing the cutting force to increase first and then decrease with an increase in particle content, and to decrease with the increase of particle size.

Key words: SiCp/Al composite, cutting, particle damage, mechanism, theoretical modeling

中图分类号:

TG506

孙伟, 王培军, 陈俊云, 段春争. SiCp/Al复合材料切削过程的颗粒损伤研究[J]. 机械工程学报, 2023, 59(15): 366-376.

SUN Wei, WANG Peijun, CHEN Junyun, DUAN Chunzheng. Research on Particle Damage during SiCp/Al Composite Machining[J]. Journal of Mechanical Engineering, 2023, 59(15): 366-376.

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SiCp/Al复合材料切削过程的颗粒损伤研究

Research on Particle Damage during SiCp/Al Composite Machining

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