多晶碳化硅陶瓷磨削裂纹损伤形成机理研究

doi:10.3901/JME.2022.13.307

机械工程学报 ›› 2022, Vol. 58 ›› Issue (13): 307-320.doi: 10.3901/JME.2022.13.307

• 制造工艺与装备 • 上一篇

扫码分享

多晶碳化硅陶瓷磨削裂纹损伤形成机理研究

戴剑博^1,2, 苏宏华³, 王忠宾^1,2, 丁文锋³, 傅玉灿³, 陈佳佳⁴

1. 中国矿业大学机电工程学院徐州 221008;
2. 中国矿业大学矿山智能采掘装备省部共建协同创新中心徐州 221008;
3. 南京航空航天大学机电学院南京 210016;
4. 南京林业大学机械电子工程学院南京 210037

收稿日期:2021-08-25 修回日期:2022-03-14 出版日期:2022-07-05 发布日期:2022-09-13
通讯作者: 苏宏华(通信作者),男,1966年出生,博士,教授,博士研究生导师。主要研究方向为高效精密加工。E-mail:shh@nuaa.edu.cn
作者简介:戴剑博,男,1989年出生,博士,讲师。主要研究工程陶瓷高效低损伤加工。E-mail:jianbodai@cumt.edu.cn
基金资助:
江苏省基础研究计划（自然科学基金）（BK20210495）、中国博士后科学基金（2020M681761）和江苏高校优势学科建设工程（苏政办发[2018]87号）资助项目。

Research on the Crack Damage Formation Mechanisms of Polycrystalline Silicon Carbide Ceramics in Grinding Process

DAI Jianbo^1,2, SU Honghua³, WANG Zhongbin^1,2, DING Wenfeng³, FU Yucan³, CHEN Jiajia⁴

1. College of Mechanical and Electrical Engineering, China University of Mining and Technology, Xuzhou 221008;
2. Jiangsu Collaborative Innovation Center of Intelligent Mining Equipment, China University of Mining and Technology, Xuzhou 221008;
3. College of Mechanical and Electronical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016;
4. College of Mechanical and Electronical Engineering, Nanjing Forestry University, Nanjing 210037

Received:2021-08-25 Revised:2022-03-14 Online:2022-07-05 Published:2022-09-13

摘要/Abstract

摘要： 当前碳化硅陶瓷类硬脆材料磨削损伤形成机理研究主要是基于经典压痕断裂力学基础理论，然而对于具有复杂显微结构的陶瓷材料，磨削亚表面裂纹损伤形式和萌生扩展机理未必遵循经典压痕断裂力学理论。有鉴于此，重点从陶瓷材料显微结构层面开展碳化硅陶瓷磨削损伤形成机理研究，采用单颗金刚石磨粒轴向进给磨削试验方法，借助聚焦离子束、透射电镜等设备，分析碳化硅陶瓷磨削损伤特点，发现穿晶裂纹具有显著择优取向性，晶界对裂纹萌生具有显著诱导作用、对裂纹扩展具有显著阻碍作用；提出了SiC陶瓷磨削亚表面晶界裂纹系统，揭示了位错在晶界处塞积是晶界裂纹系统产生的机理；随磨削进行，SiC陶瓷磨削亚表面晶界裂纹系统分别经历位错激发、位错运动至晶界处堆积、晶界处微裂纹萌生、晶界处微裂纹扩展汇合形成宏观沿晶裂纹和穿晶裂纹、裂纹扩展至磨削表面形成破碎凹坑五个跨尺度演化过程；基于位错塞积理论建立了晶界裂纹系统一般性的断裂力学模型，解析裂纹萌生与扩展临界条件；建立了晶粒尺度单颗金刚石磨削多晶SiC陶瓷有限元仿真模型，验证了SiC陶瓷磨削亚表面晶界裂纹系统模型的准确性。

关键词: 碳化硅陶瓷, 亚表面裂纹损伤, 显微结构, 晶界裂纹系统

Abstract: The previous studies on the crack damage formation mechanism of the brittle materials grinding are mainly based on the classical indentation fracture mechanics. However, due to the microstructural heterogeneity of ceramics, the typical cracks generated in the ground surface/subsurface of SiC ceramics are not in accordance with the median/radial cracks system produced in the indentation process, the indentation fracture mechanics may not be valid for the analysis of the crack initiation and propagation during grinding SiC ceramics. Hence, the present research mainly focuses on the crack damage formation mechanism of SiC ceramics grinding from the microstructure perspective. A single diamond grinding method with axial feeding was applied on sintered silicon carbide (SSiC) to explore the role of microstructure on the crack damage formation mechanism. A scanning electron microscope and a transmission electron microscope were used to examine the surface and subsurface morphologies of the grinding groove, respectively. It is found that the propagation of semi-trangranular cracks has preferred direction, and the grain boundaries have distinct induction on the crack initiation and evident obstruction on the crack propagation. The grain boundary crack system is proposed on the subsurface of the ground SSiC, which was caused by the dislocation pileups at grain boundaries. As grinding proceeds, the trans-scale evolution of the grain boundary crack system experiences five stages:dislocation activating, dislocation moving to grain boundary and piling up, microcrack initiating at grain boundary, microcracks propagating and merging into macro intergranular crack and transgranular crack at grain boundary, intergranular crack and transgranular crack propagating to ground surface forming fractured pit. Based on the dislocations pile-up theory, a general fracture mechanics model of the grain boundary cracks system was built, and the critical conditions of the cracks initiation and propagation were analyzed. Finally, an FE model of single diamond grinding polycrystalline SiC ceramics is built to verify the grain boundary cracks system model.

Key words: silicon carbide ceramics, subsurface crack damage, microstructure, grain boundaries cracks system

中图分类号:

TG580

戴剑博, 苏宏华, 王忠宾, 丁文锋, 傅玉灿, 陈佳佳. 多晶碳化硅陶瓷磨削裂纹损伤形成机理研究[J]. 机械工程学报, 2022, 58(13): 307-320.

DAI Jianbo, SU Honghua, WANG Zhongbin, DING Wenfeng, FU Yucan, CHEN Jiajia. Research on the Crack Damage Formation Mechanisms of Polycrystalline Silicon Carbide Ceramics in Grinding Process[J]. Journal of Mechanical Engineering, 2022, 58(13): 307-320.

参考文献

[1] DZURAK A. Quantum computing:diamond and silicon converge[J]. Nature,2011,479:47-8.
[2] SHORE P. Precision engineering for astronomy and gravity science[J]. CIRP Annals-Manufacturing Technology,2010,59:694-716.
[3] 于思远,林彬. 工程陶瓷材料的加工技术及其应用[M]. 北京:机械工业出版社,2008. YU Siyuan,LIN Bin. Processing technology and application of engineering ceramics[M]. Beijing:China Machine Press,2008.
[4] LAWN B R,EVANS A G. A model for crack initiation in elastic/plastic indentation fields[J]. Journal of Materials Science,1977,12:2195-2199.
[5] LAMBROPOULOS J C,LI Y,FUNKENBUSCH P,et al. Non-contact estimate of grinding-induced subsurface damage[J]. Proceedings of SPIE-The International Society for Optical Engineering,1999,3782:41-50.
[6] MALKIN S,HWANG T W. Grinding mechanisms for ceramics[J]. CIRP Annal Manufacturing Technology,1996,45(2):569-580.
[7] SANJAY A,RAO P V. Grinding characteristics,material removal and damage formation mechanisms in high removal rate grinding of silicon carbide[J]. International Journal of Machine tools & Manufacture,2010,50:1077-1087.
[8] XU H H K,JAHANMIR S,WANG Y. Interactions between parallel scratches in alumina[J]. Journal American Ceramic Society,1995,78(4):881-891.
[9] PADTURE N P,EVANS C J,XU H H K,et al. Enhanced machinability of a silicon carbide ceramic via microstructure design[J]. Journal American Ceramic Society,1995,78(1):215-217.
[10] XU H H K,JAHANMIR S. Scratching and Grinding of a machinable glass-ceramic with weak interfaces and rising T-curve[J]. Journal American Ceramic Society,1995,78(2):497-500.
[11] WU H Z,INKSON B J,ROBERTS S G. Subsurface deformation of machined Al₂O₃ and Al₂O₃/5vol%SiC nanocomposite[J]. Journal of Microscopy,2001,201:212-220.
[12] 陶文宏,杨中喜,师瑞霞. 现代材料测试技术[M]. 北京:化学工业出版社,2013. TAO Wenhong,YANG Zhongxi,SHI Ruixia. Modern material testing technology[M]. Beijing:Chemical Industry Press,2013.
[13] JOHNSON G R,HOLMQUIST T J. An improved computational constitutive model for brittle materials[J]. Journal of Applied Physics,1994,309:981-984.
[14] ZARUDI I,ZHANG L. On the limit of surface integrity of alumina by ductile-mode grinding[J]. Journal of Engineering Materials and Technology,2000,122:129-134.
[15] SHIH C J,MEYERS M A,NESTERENKO V F,et al. Damage evolution in dynamic deformation of silicon carbide[J]. Acta Materialia,2000,48:2399-2420.
[16] MALKIN S,HWANG T W,Grinding mechanisms for ceramics[J]. CIRP Annals,1996,45(2):569-580.
[17] LAWN B R,PADTURE N P,GUIBERTEAU F,et al. A model for microcrack initation and propagation beneath Hertzian contacts in polycrystalline ceramics[J]. Acta Metal Material,1994,42(5):1683-1693.
[18] ASHBY M F,HALLAM S D. The failure of brittle solids containing small cracks under compressive stress states. Acta Metallurgica,1986,34(3):497-510.
[19] JAEGER J C,COOK N G W. Fundamentals of Rock Mechanics[M]. New York:Chapman & Hall,1971.
[20] JOÖS B,REN Q. Peierls-Nabarro model of dislocations in silicon with generalized stacking-fault restoring forces[J]. Physical Review B,1994,50(9):5890-5898.
[21] LAWN B R. Fracture of brittle solids[M]. 2nd edn. Cambridge University Press (1993).
[22] LATHABAI S,RÖDEL J,LWAN B R,et al. Fracture mechanics model for subthreshold indentation flaws[J]. Journal Material Science,1991,26,2157.
[23] ZHANG D,ZHAO L G,ROY A. Mechnical behavior of silicon carbide under static and dynamic compression[J]. Journal of Engineering Materials and Technology,2019,141(011007):1-10.

编辑推荐

Metrics

阅读次数

全文

410

HTML			PDF

最新录用	在线预览	正式出版	最新录用	在线预览	正式出版
0	0	0	0	0	410

来源	本网站	其他网站

次数	363	47
比例	89%	11%

摘要

441

最新录用	在线预览	正式出版

0	0	441

来源	本网站	其他网站

次数	382	59
比例	87%	13%

多晶碳化硅陶瓷磨削裂纹损伤形成机理研究

Research on the Crack Damage Formation Mechanisms of Polycrystalline Silicon Carbide Ceramics in Grinding Process

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 5

编辑推荐

Metrics

本文评价

[1]	王美荣, 陈敏, 蒋嘉豪, 宋晓国, 唐冬雁, 曹健. 激光表面毛化对Ti/K9玻璃扩散焊接头性能的影响[J]. 机械工程学报, 2023, 59(14): 130-137.
[2]	戴剑博, 苏宏华, 傅玉灿, 丁文锋, 司垒, 陈佳佳. 磨削速度对碳化硅陶瓷磨削损伤影响机制研究[J]. 机械工程学报, 2022, 58(21): 316-330.
[3]	曹建国, 张勤俭. 碳化硅陶瓷超声振动辅助磨削材料去除特性研究[J]. 机械工程学报, 2019, 55(13): 205-211.
[4]	方爽, 熊华平, 程耀永, 林海, 于秋颖, 任新宇, 王淑云. Ti₂AlNb粉末与Ti/Al纳米叠层箔带混合烧结高温微叠层材料的微观结构^*[J]. 机械工程学报, 2017, 53(6): 73-79.
[5]	许崇海;吴光永;张永莲;衣明东;肖光春;方斌. 多元梯度自润滑陶瓷刀具材料的研制[J]. , 2014, 50(7): 94-101.