基于断裂机理的板级电路光纤埋入结构设计

doi:10.3901/JME.2016.09.158

机械工程学报 ›› 2016, Vol. 52 ›› Issue (9): 158-165.doi: 10.3901/JME.2016.09.158

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基于断裂机理的板级电路光纤埋入结构设计

成磊¹, 周德俭², 吴兆华²

1. 西安电子科技大学机电工程学院西安 710071;
2. 桂林电子科技大学机电工程学院桂林 541004

出版日期:2016-05-05 发布日期:2016-05-05
作者简介:成磊,男,1980年出生,博士研究生。主要研究方向为光电互联技术。E-mail：cenlei@126.com;周德俭(通信作者),男,1954年出生,博士,教授,博士研究生导师。主要研究方向为电气互联技术。E-mail：emezdj@guet.edu.cn
基金资助:
广西壮族自治区自然科学基金(2011GXNSFF018004)和某部预研资助项目

Design of the Optical Fiber Embedded Structure in PCB-Level Circuit Based on the Fracture Mechanism

CHENG Lei, ZHOU Dejian, WU Zhaohua

1. School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071;
2. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004)

Online:2016-05-05 Published:2016-05-05

摘要/Abstract

摘要： 板级光电互联中,光纤埋入结构的设计既要保证光路地对准,又要保证光纤在层压工艺过程中不被破坏,这大大增加了PCB制造的难度。针对光纤埋入工艺过程中可能出现的问题进行分析研究,设计一种新的光纤埋入结构。对光纤埋入工艺与光纤断裂机理进行理论分析;基于有限元理论建立光纤埋入结构的仿真模型,对光纤埋入工艺进行数值模拟分析。结果表明,填充环氧树脂胶可降低层压过程中光纤所受最大应力,并且刻槽形状对光纤所受最大应力也有影响。设计一种新的槽型结构并对它进行了光纤埋入过程中的应力分析,研究光纤所受最大应力与槽底角度和侧壁间距的关系,并结合工程实际,分析了光纤尺寸公差和划片机加工精度对其应力的影响。研究表明,该板级电路光纤埋入结构设计在保证光路对准的基础上,制造过程中光纤所受的最大应力明显降低,具有较好的可加工性。

关键词: 工艺仿真, 光电互联, 光纤埋入, 结构设计

Abstract: The designs of the optical fiber embedded structure in PCB-level circuit not only needs optical link alignment, but also ensure that fiber is not damaged in the process of laminating process. It increases the difficulty to PCB manufacturing. So the problems which may take place during the manufacturing process and design a new kind of optical fiber embedded structure is studied. Optical fiber embedded process is introduced and optical fiber fracture mechanism is analyzed in theory. The simulation model of the optical fiber embedded structure based on the finite element theory is established and the optical fiber embedded process was analyzed by numerical simulation. The results indicate that the maximum stress in the lamination process can be reduced by filling with epoxy glue and the groove shapes also have influence on the maximum stress. An original groove type topology structure is designed. The stress condition is analyzed when optical fiber embedding the groove structure and discussed the relationship between the maximum stress on optical fiber and the angle in the bottom of the groove, also the distance optical fiber to the groove wall. Combined with practical engineering, the influence is researched which to the stress caused by fiber size tolerance and scribing machining precision. It shows that the design of the optical fiber embedded structure not only effectively reduces the maximum stress which the fiber enduring in the manufacturing process, but also has good workability on the premise of guaranteeing optical link alignment.

Key words: optical fiber embedded, photoelectric interconnection, process simulation, structure design

中图分类号:

TN252

成磊, 周德俭, 吴兆华. 基于断裂机理的板级电路光纤埋入结构设计[J]. 机械工程学报, 2016, 52(9): 158-165.

CHENG Lei¹, ZHOU Dejian², WU Zhaohua². Design of the Optical Fiber Embedded Structure in PCB-Level Circuit Based on the Fracture Mechanism[J]. Journal of Mechanical Engineering, 2016, 52(9): 158-165.

参考文献

[1] ZHOU Dejian,CHENG Lei. The domestic and international research situation of photoelectric interconnection technology[J]. Advanced Materials Research,2013,760：383-387.
[2] DOANY F,LEE B,SCHOW C,et al. Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects[C] //Electronic Components and Technology Conference (ECTC),2010 Proceedings 60th. IEEE,2010：58-65.
[3] BRUSBERG L,SCHRODER H,ERXLEBEN R,et al. Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling[C]//Electronic Components and Technology Conference (ECTC),2010 Proceedings 60th. IEEE,2010：269-274.
[4] CHO M H,CHO H S,HWANG S H,et al. Optical interconnection schemes using micro-optic connectors for passive packaging in optical PCBs[C]//Electronic Components and Technology Conference,2005 Proceedings 55th. IEEE,2005：1830-1834.
[5] 冯向华,温昌礼,季家镕,等. 用于光互连的聚硅氧烷脊型光波导研究[J]. 光电子. 激光,2011,22(1)：38-41.
FENG Xianghua,WEN Changli,JI Jiarong,et al. Study on polysiloxane ridge multimode optical waveguides for optical interconnection[J]. Journal of Optoelectronics. Laser,2011,22(1)：38-41.
[6] YUAN Jing,LUO Fengguang,ZHOU Xinjun,et al. Optical interconnection in embedded-fiber printer circuit boards[J]. Optik-International Journal for Light and Electron Optics,2008,119(1)：46-50.
[7] 刘泰,翟庆诗,刘红峰. 通信用光纤可靠性影响因素分析[J]. 光通信研究,2012(5)：33-36.
LIU Tai,ZHAI Qingshi,LIU Hongfeng. Analysis of factors affecting optical fiber reliability[J]. Study on Optical Communications,2012(5)：33-36.
[8] ERPS V. Design and tolerance analysis of out-of-plane coupling components for printed-circuit-board-level optical interconnections[J]. IEEE Journal of Selected Topics in Quantum Electronics,2010,16(5)：1347-1354.
[9] HENDRICKX N,Van ERPS J,BOSMAN E,et al. Embedded micromirror inserts for optical printed circuit boards[J]. IEEE Photonics Technology Letters,2008,20：1727-1729.
[10] ISHII Y,KOIKE S,ARAI Y,et al. SMT-compatible optical-I/O chip packaging for chip-level optical interconnects[C]//Electronic Components and Technology Conference,2001 Proceedings 51st. IEEE,2001：870-875.
[11] RHO B S,KANG S,CHO H S,et al. PCB-compatible optical interconnection using 45-ended connection rods and via-holed waveguides[J]. Journal of Lightwave Technology,2004,22(9)：2128.
[12] SCHNEIDER M,KÜHNER T,MOHR J,et al. Fibers in printed circuit boards with passively aligned coupling[J]. Journal of Lightwave Technology,2010,28(15)：2121-2128.
[13] CHO H S,SHIN K U,KIM D S,et al. Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications[J]. Optical Engineering,2004,43(12)：3083-3088.
[14] 冯端. 金属物理学(第三卷)[M]. 北京：科学出版社,1999.
FENG Duan. Metal physics(3th Vol.) [M]. Beijing：Sciences Press,1999.
[15] 切列帕诺夫.脆性断裂力学[M]. 北京：科学出版社,1990.
CHEREPANOV G. Mechanics of brittle fracture[M]. Beijing：Sciences Press,1990.
[16] 刘荣梅,梁大开,王妮,等. 光纤力学性能的试验研究[J]. 实验力学,2007,22(1)：79-84.
LIU Rongmei,LIANG Dakai,WANG Ni,et al. Mechanical properties study for optical fibers[J]. Journal of Experimental Mechanics,2007,22(1)：79-84.
[17] HU Fukai,ZHOU Dejian,CHENG Lei. Research and design of optical-fiber-embedded structure in optical printed circuit board under thermal shock[J]. Advanced Materials Research,2013,763：238-241.

基于断裂机理的板级电路光纤埋入结构设计

Design of the Optical Fiber Embedded Structure in PCB-Level Circuit Based on the Fracture Mechanism

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