晶粒取向对微细加工磨削力作用机理及试验研究

doi:10.3901/JME.2021.05.262

摘要/Abstract

摘要： 微磨削加工中切削深度尺度一般小于被加工材料晶粒大小平均尺度，磨削刃作用在晶粒内部，工件材料表现为各向异性，因此，材料晶粒取向对磨削力作用较传统磨削更加显著，微磨削力的产生机理也会发生变化。为了探究晶粒取向对微细加工磨削力的作用机理，提出泰勒因子模型，量化晶粒取向对流动应力的影响，完善材料的流动应力本构模型。通过研究剪切面晶粒取向与滑移面之间的夹角以及剪切方向与滑移方向之间的夹角关系，确定激活滑移系的数量及类别，从而得到泰勒因子值。基于考虑泰勒因子模型的流动应力本构模型及平行剪切带理论，分析晶粒取向对切屑成形力作用机理并构建解析模型。通过磨棒形貌试验测量数据提取及拟合，提出新的磨棒静态磨粒密度的计算方法，进而构建动态磨粒密度模型。基于单颗磨粒磨削力模型以及磨棒动态磨粒密度模型，构建微细加工磨削力的预测模型。本模型综合考虑微磨削过程中力-热耦合效果、材料微观结构、磨棒形貌以及微磨削加工工艺，并通过微磨削试验对磨削力模型进行了验证。

关键词: 微磨削, 磨削力, 晶粒取向, 泰勒因子, 流动应力, 磨棒静态磨粒密度

Abstract: In micro-grinding, the effects of crystallography on grinding force become significant, since the depth of cut is less than the grain size. Consequently, the mechanism of micro-grinding is distinctive from the macro-grinding. The Taylor factor model for polycrystalline materials is proposed to quantify the crystallographic orientation (CO) with respect to the cutting direction by examining the number and type of activated slip systems. Then, the flow stress model is developed, based on which, the predictive model of chip formation force is proposed by adapting parallel-sided shear zone theory. The new approach for calculating the static grit density of grinding wheel is proposed based on the measurement of the wheel morphology. A comprehensive model is then proposed to predict the micro-grinding force by consolidating mechanical and thermal effects, crystallographic effects, the grinding wheel topography, and process parameters. An orthogonal-designed experiment is conducted to validate the force model, with the result proving that the prediction of the model is capable to capture the magnitude and trend of the experimental data.

Key words: micro-grinding, grinding force, crystallographic orientation, Taylor factor, flow stress, static grit density

中图分类号:

TG584

茅健, 赵嫚, 张立强. 晶粒取向对微细加工磨削力作用机理及试验研究[J]. 机械工程学报, 2021, 57(5): 262-272.

MAO Jian, ZHAO Man, ZHANG Liqiang. Theoretical Analysis and Experimental Validation of Micro-grinding Force Considering the Effect of Crystallographic Orientation[J]. Journal of Mechanical Engineering, 2021, 57(5): 262-272.

参考文献

[1] 徐路遥,李蓓智,杨建国. 考虑硬度的高弹性合金钢3J33微细特征磨削仿真分析及试验研究[J]. 中国机械工程,2019,30(1):17-21.XU Luyao,LI Beizhi,YANG Jianguo. Simulaton analysis and experimental validation of micro-feature grinding for high-elastic alloy steel 3J33 with considering hardness[J]. China Mechanical Engineering,2019,30(1):17-21.
[2] LU X,JIA Z,YANG K,et al. Analytical model of work hardening and simulation of the distribution of hardening in micro-milled nickel-based superalloy[J]. International Journal of Advanced Manufacturing Technology,2018,97(9-12):3915-3923.
[3] LU X,HU X,JIA Z,et al. Model for the prediction of 3D surface topography and surface roughness in micro-milling Inconel 718[J]. International Journal of Advanced Manufacturing Technology,2018,94(5-8):2043-2056.
[4] FENG Y,HUNG T P,LU Y T,et al. Inverse analysis of inconel 718 laser-assisted milling to achieve machined surface roughness[J]. International Journal of Precision Engineering and Manufacturing,2018,19(11):1611-1618.
[5] 张浩,刘玉德,石文天,等. 微细切削加工表面质量的研究综述[J]. 表面技术,2017,46(7):219-232.ZHANG Hao,LIU Yude,SHI Wentian,et al. Quality of micro machined surface[J]. Surface Technology,2017,46(7):219-232.
[6] SETTI D,KIRSCH B,AURICH J C. An Analytical method for prediction of material deformation behavior in grinding using single grit analogy[J]. Procedia CIRP,2017,58:263-268.
[7] 李伟,周志雄,尹韶辉,等. 微细磨削技术及微磨床设备研究现状分析与探讨[J]. 机械工程学报,2016,52(17):10-19.LI Wei,ZHOU Zhixiong,YIN Shaohui,et al. Research status analysis and review of micro-grinding technology and micro-grinding machines[J]. Journal of Mechanical Engineering,2016,52(17):10-19.
[8] PARK H W,LIANG S Y. Force modeling of micro-grinding incorporating crystallographic effects[J]. International Journal of Machine Tools and Manufacture,2008,48(15):1658-1667.
[9] YIN J,BAI Q,HAITJEMA H,et al. Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering[J]. Journal of Materials Processing Technology,2020,284:116746.
[10] ZHANG B,YIN J. The ‘skin effect’ of subsurface damage distribution in materials subjected to high-speed machining[J]. International Journal of Extreme Manufacturing,2019,1(1):012007.
[11] YANG X,ZHANG B. Material embrittlement in high strain-rate loading[J]. International Journal of Extreme Manufacturing,2019,1(2):022003.
[12] YIN J,BAI Q,LI Y,et al. Formation of subsurface cracks in silicon wafers by grinding[J]. Nanotechnology and Precision Engineering,2018,1(3):172-179.
[13] VENKATACHALAM S,LI X,LIANG S Y. Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials[J]. Journal of Materials Processing Technology,2009,209(7):3306-3319.
[14] HUANG Y,LIANG S Y. Force modelling in shallow cuts with large negative rake angle and large nose radius tools application to hard turning[J]. The International Journal of Advanced Manufacturing Technology,2003,22(9-10):626-632.
[15] 温雪龙,巩亚东,程军,等. 铝合金Al6061微尺度磨削力热特性试验分析[J]. 机械工程学报,2014,50(23):165-174.WEN Xuelong,GONG Yadong,CHENG Jun,et al. Experimental research on force and temperature characteristics in micro-grinding Al6061[J]. Journal of Mechanical Engineering,2014,50(23):165-174.
[16] 尹国强,巩亚东,温雪龙,等. 新型点磨削砂轮磨削力模型及试验研究[J]. 机械工程学报,2016,52(9):193-200.YIN Guoqiang,GONG Yadong,WEN Xuelong,et al. Modeling and experimental investigations on point grinding force for novel point grinding wheel[J]. Journal of Mechanical Engineering,2016,52(9):193-200.
[17] HUGHES G D,SMITH S D,PANDE C S. Hall-Petch strengtheninig for the microhardness of twelve nanometer grain diameter electrodeposited nickel[J]. Scripta Metallurgica,1986,20:93-97.
[18] HUGHES D A,HANSEN N. Microstructure and strength of nickel at large strains[J]. Acta Materialia,2000,48(11):2985-3004.
[19] HANSEN N. Polycrystalline strengthening[J]. Metall Trans A,1985,16(12):2167-2190.
[20] VENKATACHALAM S,LI X,FERGANI O,et al. Crystallographic effects on microscale machining of polycrystalline brittle materials[J]. Journal of Micro and Nano-Manufacturing,2013,1(4):041001.
[21] XU F,FANG F,ZHU Y,et al. Study on crystallographic orientation effect on surface generation of aluminum in nano-cutting[J]. Nanoscale Res Lett,2017,12(1):289.
[22] UEDA K,IWATA K,NAKAYAMA K. Chip formation mechanism in single crystal cutting of β-brass[J]. CIRP Ann,1980,29(1):41-46.
[23] SHIBATA T,FUJII S,MAKINO E,et al. Ductile-regime turning mechanism of single-crystal silicon[J]. Precision Engineering,1996,18(2-3):129-137.
[24] WU X,LI L,HE N,et al. Investigation on the influence of material microstructure on cutting force and bur formation in the micro cutting of copper[J]. International Journal of Advanced Manufacturing Technology,2015,79(1-4):321-327.
[25] SHARIF U M,SEAH K H W,LI X P,et al. Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon[J]. Wear,2004,257(7-8):751-759.
[26] ZHAO M,JI X,LIANG S Y. Influence of AA7075 crystallographic orientation on micro-grinding force[J]. Proceedings of the Institution of Mechanical Engineers,Part B:Journal of Engineering Manufacture,2018,233(8):1831-1843.
[27] BLANCKENHAGEN B V,GUMBSCH P,ARZT E. Dislocation sources in discrete dislocation simulations of thin-film plasticity and the Hall-Petch relation[J]. Modell Simul Mater Sci Eng,2001,9(3):157.
[28] JUSTINGER H,HIRT G. Estimation of grain size and grain orientation influence in microforming processes by Taylor factor considerations[J]. Journal of Materials Processing Technology,2009,209(4):2111-2121.
[29] ZHAO M,JI X,LIANG S Y. Force prediction in micro-grinding maraging steel 3J33b considering the crystallographic orientation and phase transformation[J]. The International Journal of Advanced Manufacturing Technology,2019,103(5-8):2821-2836.
[30] MERCHANT M E. Mechanics of the metal cutting process. II. plasticity conditions in orthogonal cutting[J]. Journal of Applied Physics,1945,16(6):318-324.
[31] 李伯民,李清,赵波. 磨料、磨具与磨削技术[M]. 北京:机械工业出版社,2010. LI Bomin,LI Qing,ZHAO Bo. Abrasive,abrasive tool, and grinding technology[M]. Beijing:China Machine Press,2010.
[32] YOUNIS M A,ALAWI H. Probabilistic Analysis of the Surface Grinding Process[J]. T. Can. Soc. Mech. Eng.,1984,8(4):208-213.
[33] ROWE W B,MORGAN M N,QI H S,et al. The effect of deformation on the contact area in grinding[J]. CIRP,1993,42(1):409-412.
[34] PARK H W,PARK Y B,LIANG S Y. Multi-procedure design optimization and analysis of mesoscale machine tools[J]. International Journal of Advanced Manufacturing Technology,2011,56(1-4):1-12.
[35] 官春平. 圆柱与刚性平面Hertz接触的临界参数计算[J]. 轴承,2013(8):4-7.GUAN Chunping. Calculation of critical parameters for Hertz contact between cylinder and rigid plane[J]. Bearing,2013(8):4-7.
[36] YANG F,ZHANG B,WANG J,et al. The effect of grinding machine stiffness on surface integrity of silicon nitride[J]. Journal of Manufacturing Science and Engineering,2000,123(4):591-600.
[37] PARK H W. Development of micro-grinding mechanics and machine tools[D]. Atlanta:Georgia Institute of Technology,2008.
[38] 虞粉英,陆锦辉. 数字信号处理中的对称性问题[J]. 南京理工大学学报,2018,42(5):615-621.YU Fenying,LU Jinhui. Symmetry in digital signal processing[J]. Journal of Nanjing University of Science and Technology,2018,42(5):615-621.