• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2019, Vol. 55 ›› Issue (18): 36-42.doi: 10.3901/JME.2019.18.036

• 材料科学与工程 • 上一篇    

复合结构衬套合金界面结合性能

王建梅, 夏全志, 侯定邦, 姚坤   

  1. 太原科技大学重型机械教育部工程研究中心 太原 030024
  • 收稿日期:2018-10-11 修回日期:2019-02-22 发布日期:2020-01-07
  • 通讯作者: 王建梅(通信作者),女,1972年出生,博士,教授。主要研究方向为工业摩擦学和界面科学。E-mail:wjmhdb@163.com
  • 基金资助:
    国家自然科学基金(51875382,U1610109)、山西省重点研发计划(指南)(201803D421103)和太原重型机械装备协同创新中心专项(1331工程)资助项目。

Interfacial Bonding Properties of Metal Bushing with Composite Structure

WANG Jianmei, XIA Quanzhi, HOU Dingbang, YAO Kun   

  1. Engineering Research Center of Heavy Machinery, Ministry of Education, Taiyuan University of Science and Technology, Taiyuan 030024
  • Received:2018-10-11 Revised:2019-02-22 Published:2020-01-07

摘要: 为了深入探讨层状金属复合材料连接界面的结合性能,以新型复合结构衬套巴氏合金ZChSnSb8-4为研究对象,在原子替代法建模特点的基础上,考虑巴氏合金中Cu6Sn5、SnSb、Sn三种组分含量配比,对多层合金复合衬套界面间结合性能进行分子动力学模拟分析。计算结果表明:结合界面的层数对结合性能有着明显的影响,五层复合结构衬套的最小界面结合能比三层复合结构衬套的最小界面结合能大33.87%,即五层复合结构衬套界面结合性能优于三层复合结构衬套。同时从不同结构衬套相邻两界面的结合能发现,不同复合层结构的衬套可能导致的危险结合界面不同。钢铅合金层与镍栅层之间的界面结合能最大,结合最牢固;镍栅层与巴氏合金层的界面结合能最小,最易发生合金脱落现象。从分子层面研究了新型复合结构衬套界面的结合机理,可为生产实践提供参考依据。

关键词: 分子动力学, 复合材料, 巴氏合金, 界面结合能, 结合机理

Abstract: In order to investigate the bonding properties of the interface of laminated metal composites, a new type of composite structure bushing babbitt alloy ZChSnSb8-4 is studied based on the modelling characteristics of atomic substitution method. Considering the proportion of three components of Cu6Sn5, SnSb, Sn in babbitt alloy, the interfacial bonding properties of multilayer alloy composite bushing are simulated and studied using molecular dynamics method. The results show that the minimum interfacial bonding energy of five-layer structure bushing is 33.87% higher than that of three-layer structure bushing, so the interfacial bonding performance of five-layer structure bushing is better than that of three-layer structure bushing. Meanwhile, according to the bonding energy of the adjacent two interfaces of different structure bushing, it is found that the dangerous bonding interface may be caused by different composite layer bushing. The interfacial bonding energy betweensteel-lead alloy layer andnickel gate layer is the largest and the bond is the strongest, and the interface bonding energy between nickel gate layer and babbitt alloy layer is the least, and the phenomenon of alloy falling off is the most likely. A new type of compound structure bushing is studied from the molecular level, and the bonding mechanism of the interfaces provides a reference for the production practice.

Key words: molecular dynamics, composite, babbitt, interface bonding energy, bonding mechanism

中图分类号: