采用芯片直接安装技术封装的风速风向传感器

›› 2009, Vol. 45 ›› Issue (1): 218-222.

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采用芯片直接安装技术封装的风速风向传感器

沈广平;张骅;吴剑;秦明;黄庆安

东南大学MEMS教育部重点实验室

发布日期:2009-01-15

Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor

SHEN Guangping;ZHANG Hua;WU Jian;QIN Ming;HUANG Qingan

Key Laboratory of MEMS of Ministry of Education, Southeast University

Published:2009-01-15

摘要/Abstract

摘要： 提出一种采用芯片直接安装(Direct chip attach，DCA)技术封装的风速风向传感器的设计，制备和测试结果。该传感器采用圆形结构，利用热温差的方法测量二维风速和风向。其利用两步金属剥离工艺直接将在感风陶瓷基板上芯片制作出传感器芯片，利用封装胶将优质芯片倒贴在打孔印制电路板上并进行引线键合，用绝热封装胶对芯片进行封包，形成最终的封装。对封装后的传感器芯片进行风洞测试，传感器可以完成360º风向检测，风速量程为6 m/s。

关键词: 风速传感器, 风向传感器, 微系统封装, 芯片直接安装

Abstract: The design, fabrication and test of a direct chip attach packaged thermal flow sensor is given. The circular structure sensor measures the 2-D wind speed and direction by using calorimetric principle. The calorimetric flow sensor is fabricated by using two-step metal lift-off process on a ceramic slice. Then the KGD is glued to the backside of PCB board with package resin, and wire is bonded to the front side of PCB through a prefabricated hole. Finally, the chip is capsulated using thermal insulated package resin on the front side. The wind tunnel test of the packaged sensor chip is carried out. The sensor can detect 360° wind direction in a wind speed range of 6 m/s.

Key words: Direct chip attach, MEMS package, Wind direction sensor, Wind speed sensor

中图分类号:

TN36

沈广平;张骅;吴剑;秦明;黄庆安. 采用芯片直接安装技术封装的风速风向传感器[J]. , 2009, 45(1): 218-222.

SHEN Guangping;ZHANG Hua;WU Jian;QIN Ming;HUANG Qingan. Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor[J]. , 2009, 45(1): 218-222.

采用芯片直接安装技术封装的风速风向传感器

Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor

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