• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2018, Vol. 54 ›› Issue (13): 208-214.doi: 10.3901/JME.2018.13.208

• 制造工艺与装备 • 上一篇    下一篇

多线往复式线锯切割中单位长度材料去除量的理论分析与试验研究

林志树1,2, 黄辉1, 郑生龙1   

  1. 1. 华侨大学制造工程研究院 厦门 361021;
    2. 厦门理工学院机械与汽车工程学院 厦门 361024
  • 收稿日期:2017-09-11 修回日期:2018-02-14 出版日期:2018-07-05 发布日期:2018-07-05
  • 通讯作者: 黄辉(通信作者),男,1974年生,博士,教授,博士研究生导师。E-mail:huangh@hqu.edu.cn
  • 作者简介:林志树,男,1973年生,博士研究生,副教授。主要研究方向为超精密加工工艺与装备。E-mail:linzs@xmut.edu.cn
  • 基金资助:
    国家自然科学基金资助项目(51375179,U1305241,51375412)。

Theoretical Analysis and Experimental Study on Material Removal Per Length of Wire in the Cutting of Multi-wire Saw with Reciprocating

LIN Zhishu1,2, HUANG Hui1, ZHENG Shenglong1   

  1. 1. Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021;
    2. School of Mechanical and Automotive Engineering, Xiamen University of Technology, Xiamen 361024
  • Received:2017-09-11 Revised:2018-02-14 Online:2018-07-05 Published:2018-07-05

摘要: 线锯切割被广泛地应用于光伏和微电子行业及其他硬脆材料的切割加工,所切晶片的质量影响后续研抛等工序的加工。建立了多线线锯往复运动与进给运动的理论模型,提出单位长度材料去除量的概念,推导出多线往复线锯切割中,单位长度材料去除量随加工位置变化的理论模型。理论分析了单片用线量及进给速比对单位长度材料去除量的影响规律。以蓝宝石晶棒为锯切研究对象,进行了不同的锯丝单片用线量以及不同进给速比条件下的锯切试验,测量了切割片的加工质量。研究结果表明,多线往复式切割过程中,单位长度材料去除量随加工过程有明显的变化,单片用线量及进给速比对单位长度材料去除量有明显的影响,单位长度材料去除量对线锯切割质量有着显著的影响。

关键词: 单片用线量, 单位长度材料去除量, 多线线锯, 加工质量, 进给速比

Abstract: Wire saw is widely used in wafers sawing in the photovoltaic and microelectronics industries, it also widely applied to cut other brittle materials. The quality of sawn wafer plays an important role in the subsequent machining process such as grinding and polishing. Theoretical models about reciprocating motion and feed motion of multi-wire saw are established, concept of material removal per length of wire is proposed, theoretical model about the material removal per length of wire versus cutting position are deduced. The influences of wire consumption length of a piece of wafer and feed speed ratio on the material removal per length of wire are analyzed theoretically. Sapphire ingot sawing experiments is carried out with various wire consumption lengths of a piece of wafer and feed rate ratios. The wafer qualities were measured. The experimental result showed that material removal per length of wire is different during the whole multi-wire sawing process. The material removal per length of wire is obviously influenced by the wire consumption length of a piece of wafer and feed rate ratio. The material removal per length of wire also had a significant effect on sawn quality.

Key words: feed rate ratio, material removal per length of wire, multi-wire saw, sawn quality, wire consumption length of a piece of wafer

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