Research on Defects Inspection of Solder Bumps Using Active Infrared Thermography Technology

doi:10.3901/JME.2016.10.017

Abstract

Abstract: The miniaturization and multifunctionality of IC device promote the improvement of microelectronic packaging. The solder bump technology is widely used in IC packaging. With shrinking of the solder bumps in size and pitch, defect inspection becomes more challenging for the hidden bumps. Active infrared thermography is investigated for detecting the solder bump defect. A mathematical model for infrared inspection of solder bumps is constructed and is validated by the experiments. The BGA balls with larger diameter and pitch are tested in transmissive way. The captured thermal images are processed by using an adaptive filter, and the solder balls are segmented from the image through the edge detection, which reduces the influence of thermal noise on defect identification. The area of hot spot corresponding to the solder balls are calculated for quantitative analysis. The tested chip FA10 with smaller solder bumps is also detected using the active thermography in reflective way. The salt and pepper noise is removed by using an improved adaptive filtering algorithm. The extracted temperature values are smoothed by the moving averaging operation, and then are fitted with an exponential function. The fitted temperature values are converted to the phase information by using fast Fourier transform. The missing bumps are distinguished from the reference bumps through the phase information at low frequency. The active thermography is proved to be a fast and effective method for defects inspection of solder bump in high-density IC packaging.

Key words: active infrared, solder bump, temperature difference, thermography

CLC Number:

TG156

LU Xiangning, HE Zhenzhi, HU Ningning, SU Lei, NIE Lei. Research on Defects Inspection of Solder Bumps Using Active Infrared Thermography Technology[J]. Journal of Mechanical Engineering, 2016, 52(10): 17-24.

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