• CN: 11-2187/TH
  • ISSN: 0577-6686
Research Progress of Surface Activated Bonding at Room Temperature
ZHANG Hongze, TIAN Ye, MENG Ying, MU Fengwen, WANG Xinhua, LIU Xinyu
Journal of Mechanical Engineering . 2022, (2): 136 -146 .  DOI: 10.3901/JME.2022.02.136