Development Status and Perspective Trend of Ultra-thin Micro Heat Pipe

doi:10.3901/JME.2017.20.131

Abstract

Abstract: The rapid increase of heat generation level has become a major technical challenge in the development and applications of contemporary advanced microelectronic chip system. As an efficient heat transfer device, micro heat pipes have been widely used for thermal management of electronic devices because of their excellent thermal performance and high reliability. However, with electronic devices becoming highly integrated, lighter, and thinner, traditional micro heat pipes cannot meet the usage requirement. An ultra-thin micro heat pipe has been proposed and has become the research focus of modern heat pipe technology. The types and applications of ultra-thin micro heat pipe are introduced, as well as the research progresses of wick structure and forming process of ultra-thin micro heat pipe are summarized. Furthermore, the problems existed on ultra-thin micro heat pipe technology are pointed out and it is also suggested that more efforts should be made to what in the future.

Key words: heat dissipation, ultra-thin micro heat pipe, wick structure

CLC Number:

TK124

TANG Yong, TANG Heng, WAN Zhenping, YUAN Wei, LU Longsheng, LI Zongtao. Development Status and Perspective Trend of Ultra-thin Micro Heat Pipe[J]. Journal of Mechanical Engineering, 2017, 53(20): 131-144.

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