Abstract: Interface friction affects the material removal and load characteristic of chemical mechanical polishing (CMP). The kinematic and dynamic analysis is performed for rotary type CMP system. Based on which, the expression of the interfacial friction load (including the friction torque and the friction radial load) is deduced. The laws of the load characteristic of the carrier & platen main structure variation with the kinematic parameters are investigated, which suggests that the speed ratio gives the most obvious effect on the load. With the increasing of speed ratio, the friction torque of the carrier increase, while the friction torque of the platen decrease. And there is a critical speed ratio with the value of 1 for the carrier. When the speed ratio is below 1, the friction torque appears driving torque for the carrier. In actual condition, the speed ration is close to 1, therefore, the friction torque of the carrier is nearly zero. As a result, the interface friction torque caused by the relative motion is mainly loaded by the platen. Further, a finite element analysis (FEA) model of the platen and the rotor is constructed using commercial FEA software. The deformation of the platen surface under the combined load of tightening torque, eccentric axial load and friction torque is analysed, which provides a reference for the design of CMP equipment.

Key words: chemical mechanical polishing;kinetics;friction torque;finite element analysis;polishing platen