Study on Ultrasonic Elliptical Vibration Assisted Helical Grinding Kinematic Model and Material Removal Mechanism of 2.5D-Cf/SiC Composites

doi:10.3901/JME.2025.07.229

Abstract

Abstract: The ultrasonic elliptical vibration assisted machining method was combined with helical grinding technology and applied to the hole making of 2.5D-C_f/SiC composite material. The kinematics model of ultrasonic elliptical vibration assisted helical grinding and the maximum undeformed chip thickness model were established. The influence of process parameters (spindle speed, revolution speed, pitch and ultrasonic amplitude) on the trajectory of the abrasive particles is analyzed. Based on SPH (smooth particle hydrodynamics) method, the ultrasonic vibration grinding of composite materials with different fiber directions was simulated, and the ultrasonic elliptical vibration assisted helical grinding hole making experiment is carried out. Based on the numerical simulation and experimental results, the mechanism of material removal assisted by ultrasonic elliptical vibration is analyzed. It is concluded that matrix brittle fracture, interface debonding, fiber fracture and fiber pull-out occur in the process of material removal. The fiber has an obstacle effect on the crack propagation, and the subsurface damage crack tends to propagate along the matrix-fiber interface. Increasing the spindle speed and ultrasonic amplitude can reduce the undeformed chip thickness, and increasing the pitch and revolution speed can improve the machining efficiency. This study provides a certain theoretical and practical reference for efficient and low-damage helical grinding of carbon fiber ceramic matrix composite.

Key words: ultrasonic vibration grinding, helical grinding machining, removal mechanism, SPH grinding simulation

CLC Number:

TG156

ZHOU Yunguang, CHEN Han, ZOU Ji, MA Wenmin, MA Lianjie, LI Ming, YIN Guoqiang, GONG Yadong. Study on Ultrasonic Elliptical Vibration Assisted Helical Grinding Kinematic Model and Material Removal Mechanism of 2.5D-C_f/SiC Composites[J]. Journal of Mechanical Engineering, 2025, 61(7): 229-244.

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Study on Ultrasonic Elliptical Vibration Assisted Helical Grinding Kinematic Model and Material Removal Mechanism of 2.5D-C_f/SiC Composites

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