• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2022, Vol. 58 ›› Issue (10): 265-279.doi: 10.3901/JME.2022.10.265

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Development Status and Perspective Trend of Flexible Heat Pipe

TANG Yong1,2,3, SUN Yalong1,3, TANG Heng2, WAN Zhenping1,3, YUAN Wei1,3   

  1. 1. School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640;
    2. College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen 518000;
    3. Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, Guangzhou 510640
  • Received:2021-03-15 Revised:2021-10-15 Online:2022-05-20 Published:2022-07-07

Abstract: Heat pipes, with the advantages of high heat transfer efficiency, high stability, long life and low cost, have become the main solution to the heat dissipation problem of high-performance microelectronic devices. However, the increasing popularity of flexible and wearable electronic devices raises the flexible demand for the heat dissipation system, while the traditional copper and aluminum heat pipes are unable to meet the heat dissipation demand of light and thin flexible electronic devices. The flexible heat pipe with the characteristics of flexible, high performance and lightweight has been proposed and has become the research focus of modern heat pipe technology. The structure types, encapsulation technology and application field of the flexible heat pipe are introduced, as well as the wicking structure and encapsulation technology at home and abroad are summarized. Furthermore, the shortcomings that existed on flexible heat pipe technology are pointed out and it is also suggested that more efforts should be made to what in the future.

Key words: flexible heat pipe, wick structure, microstructure manufacture, encapsulation technology, heat dissipation

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