Abstract:

：Components on waste printed circuit boards (PCB) are worthy reusing. Moreover components reusing is depended on appropriate PCB disassembly. At present researchers focus on the analysis and calculation of removal force. However, as there are melted solder between components and PCB when disassembling, even enough removal force cannot guarantee that components can be disassembled. Based on the removal force model put forward by our research group, the disassembly energy which takes both removal force and components separating displacement into account is treated as the disassembly criterion. According to it, the disassembly process under vibration is researched, the PCB modal on the condition of opposite side simply supported and the other opposite free is analyzed, based on the vibration plate theory PCB movement differential equation is built and PCB displacement and acceleration response is got. Separating process of through-hole devices and surface-mount devices under vertical disassembly is studied, and component disassembly is analyzed in situations of different excitation frequency, different location in PCB, components having different minimum disassembly acceleration. Disassembly figure method is proposed to compare the energy components get in disassembly process and the minimum energy components need, which will give a guild to disassembly parameters. At last, experiments are performed to prove the disassembly model.

Key words: disassembly criterion, vibration disassembly, printed circuit board (PCB)