• CN: 11-2187/TH
  • ISSN: 0577-6686

›› 2009, Vol. 45 ›› Issue (8): 270-275.

• Article • Previous Articles     Next Articles

Temperature Field Simulation by Layer Deposition Model Based on Micrograph

ZENG Haoping;FANG Jiancheng;XU Wenji;ZHAO Ziyu;LI Hongyou   

  1. College of Mechanical Engineering and Automation, Huaqiao University Department of Digital Control Engineering, Zhejiang Industry Polytechnic College Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology
  • Published:2009-08-15

Abstract: The service performance of coatings manufactured by plasma spray forming is closely related with their thermal residual stresses, and the thermal residual stresses are caused by the nonuniformity of temperature field during the coating deposition process. Therefore, the research on coating temperature field is the basis of residual stress analysis. Aiming at the problem that the layer deposition models generally adopted for the simulation of coating deposition temperature field cannot take the coating pores into consideration, a layer deposition model based on micrograph is proposed, in which the effects of pores are considered, is presented. The computation results show that not only the temperature field of the coatings but also that of the substrate are influenced by the pores. In the coatings, the temperature of the position near the pores decreases faster than that of the position far from the pores, and the difference is more significant at the beginning of deposition. The temperature field study with the consideration of pore effects provides the basis for the analysis of thermal residual stresses and the solution of coating failures such as warping, cracking and spalling.

Key words: Coating, Plasma spray forming, Pores, Temperature field simulation

CLC Number: