Abstract: Magnetic treatment is a new processing technology used for reducing metal residual stress in recent years. In previous studies, magnetic strain vibration was considered to be the key answer for the changes of residual stress. Magnetic strain vibrations are recorded directly and found that the swing of the oscillation is so small that the stress is impossible to slide into any plastic state. Thus, it would be hard to suppose the magnetic strain vibrations are the main factor for the stress cut down. For more proof, the curve between strain vibration and stress variety is investigated. On the opposite of the presumption that stronger vibration with greater stress reduction in the earlier approaches, the relationship is more complex. Even in some conditions, strong vibration could cause stress increment. Thus it is more suitable to conclude that behind the strain vibration there were other more crucial factors controlling stress changes.

Key words: Magnetic strain vibration, Residual stress, Grain depth of cut, Grinding, Subsurface damage, Silicon wafers