• CN: 11-2187/TH
  • ISSN: 0577-6686

›› 1993, Vol. 29 ›› Issue (2): 52-57.

• Article • Previous Articles     Next Articles

DYNAMIC DISOLUTION OF THE BASE METAL INTO THE MOTEN SOLDER IN SMT LASER MICROSOLDERING

Wang Chunqing;Qian Yiyu;Jiang Yihong   

  1. Harbin Institute of Technology
  • Published:1993-03-01

Abstract: In this paper, the dynamic dissolution of the base metal into the moten solder has been studied, and a numerical simulation model of disclution velue has been developed. A method for measuring the solution speed ratio was build. The numerical simulation results have been borne out by the tests.

Key words: Dissolution, Laser, Soldering