MODELING AND EXPERIMENT OF MATERIAL REMOVAL IN POLISHING ON MOLD CURVED SURFACES

Abstract

Abstract: Material removal profile is proposed to describe the depth of material removal orthogonal to the tool path on a mold surface. Assuming that the contact between the tool and the mold free-form surface is the elliptical Hertzian contact, the theoretical equation of the material removal profile is derived based on the presented material removal coefficient. The experimental results agree well with the simulation predictions, which reveals the regularities of material removal and verifies the theoretical model of the material removal profile.

Key words: Material removal, Elliptical Hertzian contact, Polishing, Mold curved surface

CLC Number:

TG580.692

Zhang Lei;Yuan Chuming;Zhou Zude;Chen Youping;Zheng Li. MODELING AND EXPERIMENT OF MATERIAL REMOVAL IN POLISHING ON MOLD CURVED SURFACES[J]. , 2002, 38(12): 98-102.

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MODELING AND EXPERIMENT OF MATERIAL REMOVAL IN POLISHING ON MOLD CURVED SURFACES

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