Multi-physical Field Coupling Simulation and Experimental Research on Electrolyte Plasma Polishing

doi:10.3901/JME.2025.01.360

Abstract

Abstract: In response to the difficulty in predicting the contour forming process of electrolyte plasma polishing workpieces, a multi physical field coupling simulation is conducted to analyze the characteristics of the flow field and electric field distribution during the polishing process, as well as the influence of polishing parameters on the flow field and electric field distribution. A polishing material removal model is established based on Faraday's first law. The simulation results show that a relatively stable gas layer is formed around the workpiece during the polishing process, and the gas layer exhibits a distribution feature of thin bottom and thick top. The thickness of the gas layer increases with the increase of polishing voltage and workpiece curvature radius, and decreases with the increase of workpiece immersion depth. The current density distribution streamline is gradually sparse from the bottom to the top of the workpiece, and the current density increases with the decrease of the workpiece curvature radius and polishing voltage. The amount of material removed from the surface of the workpiece gradually decreases from the bottom to the top, and the higher the power supply voltage and the larger the curvature radius of the workpiece, the lower the material removal rate. Increasing the immersion depth of the workpiece appropriately can effectively improve the material removal rate. We conducted experimental research on electrolyte plasma polishing of 316LVM stainless steel cylindrical workpieces and verified the correctness of the material removal model. The theoretical and experimental results will help to better understand the mechanism of electrolyte plasma polishing, and have important practical value for improving the stability and consistency of electrolyte plasma polishing process and polishing quality.

Key words: electrolyte plasma polishing, multi-physical field coupling, material removal model, gas layer distribution

CLC Number:

TG580
TQ153

CHEN Yangjian, YI Jun, WANG Zongwei, CHEN Bing, DENG Hui. Multi-physical Field Coupling Simulation and Experimental Research on Electrolyte Plasma Polishing[J]. Journal of Mechanical Engineering, 2025, 61(1): 360-370.

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