Mechanism Analysis and Experimental Verification of Ultrasonic Cavitation Assisted Diamond Wire Saw Cutting Monocrystalline Silicon

doi:10.3901/JME.2024.09.114

Abstract

Abstract: Diamond wire saw cutting monocrystalline silicon wafer is a key step in semiconductor manufacturing technology, and its slice quality directly affects the quality and cost of chip manufacturing. An ultrasonic cavitation assisted diamond wire saw method for cutting monocrystalline silicon wafer is proposed, the micro-jet and water hammer pressure generated by cavitation bubble collapse are used to accelerate the chip discharge, reduce the sawing force, improve the sawing performance of the wire saw and reduce the workpiece surface roughness. Based on Rayleigh equation, bubble dynamics equation of processing zone is derived. The SPH-FEM coupling method and ABAQUS software are used to establish a three-dimensional fluid-structure coupling model of near-wall micro-jet impact, and the simulation analysis is carried out. The maximum error between the simulation value and the theoretical value of the peak pressure of the water hammer generated by the micro-jet is 9.67%, which verified the reliability of the theoretical results and the simulation model. The experiment of ultrasonic cavitation assisted diamond wire saw cutting is completed. The results show that the average sawing force of an ultrasonic cavitation-assisted wire saw is 11.9%–34.5% lower than that of a traditional wire saw. The surface roughness of the workpiece decreases by 5.03% to 37.25%, the number and size of pits on the surface of the workpiece are reduced, and the surface topography is greatly improved, indicating that the ultrasonic cavitation-assisted wire saw cutting can obtain better machining quality.

Key words: diamond wire saw, ultrasonic cavitation, SPH-FEM coupling method, water hammer pressure

CLC Number:

TG48
O786

WANG Yan, HE Shun, CHEN Yizhang, JIANG Chen, QIAN Zhaofeng, CHEN Haoyi. Mechanism Analysis and Experimental Verification of Ultrasonic Cavitation Assisted Diamond Wire Saw Cutting Monocrystalline Silicon[J]. Journal of Mechanical Engineering, 2024, 60(9): 114-126.

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