• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (8): 81-89.doi: 10.3901/JME.2021.08.081

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Microstructure Manufacturing Technology of Acoustic Surface Wave High Temperature Pressure Devices Based on Langasite

LIANG Xiaorui1,2, XU Fangmeng1,2, XUE Tao1,2, TAN Qiulin1,2, DONG Helei1,2, XIONG Jijun1,2   

  1. 1. National Defense Key Laboratory of Science and Technology on Electronic Test and Measurement, North University of China, Taiyuan 030051;
    2. Key Laboratory of Instrumentation Science and Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051
  • Received:2020-12-01 Revised:2021-03-22 Online:2021-04-20 Published:2021-06-15

Abstract: A surface acoustic wave pressure sensor based on Langasite(LGS) can solve the problem of real-time in-situ measurement of temperature, pressure, and other parameters in harsh environments such as high temperature and high pressure. However, as the Langasite is a kind of hard and brittle piezoelectric material with high hardness and difficult to machine, the research on fabrication technology of microstructure of Langasite piezoelectric material in harsh environment such as high temperature is carried out. By analyzing the chemical and physical properties of LGS, the wet etching process is used to realize micro-nano fabrication and control of LGS. A sealed cavity microstructure is realized by high temperature hot pressing direct bonding process. A set of micro nanostructure forming technology suitable for LGS hard and brittle materials are developed, and the practicability of the microstructure processing and manufacturing process is explored. The SAW high-temperature pressure sensor prototype based on LGS is fabricated and tested by using pressure-sensitive microstructure realized by microstructure machining technology. The prototype can work stably at 25-1 000 ℃, 20-500 kPa, which verifies the feasibility of LGS microstructure forming technology in other harsh environments.

Key words: Langasite, surface acoustic wave, wet etching, thermocompression bonding, high temperature and pressure

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