Research on the Deformation Behavior of Ag-GNSs/SnAgCu Solders during Nanoindentation Tests

doi:10.3901/JME.2018.08.151

Abstract

Abstract: The nanoindentation test is performed using constant loading methods on composite solders at room temperature to study the deformation behaviors at micro and nano scales. Through the analysis of the load-indentation depth curves and the indentation morphologies, the "pop-in" and the deformation mechanism is studied. The "pop-in" occurred in the load-depth curves and it is attributed to the elastic-plastic transitions. The transition is relevant to the nucleation of the dislocations. Many dislocation networks are observed around the indentation via TEM. The "pile-up" is found while observing the indentation morphologies, relevant to the ratio of Young's modulus and the yield stress. It results in a smaller result of the contact area and the values of the hardness and modulus is lager than reality. A semi-ellipse model is used to revise the result with "pile-up" and a new result of the hardness and Young's modulus is obtained based on the Oliver-Pharr method. The hardness is 18.3% lower that that before revising and the Young's modulus is 9.5% lower.

Key words: elastic deformation, microstructure, nanoindentation, SnAgCu solder alloys

CLC Number:

TB333

XU Lianyong, ZHANG Shuting, JING Hongyang, HAN Yongdian. Research on the Deformation Behavior of Ag-GNSs/SnAgCu Solders during Nanoindentation Tests[J]. Journal of Mechanical Engineering, 2018, 54(8): 151-156.

References

[1] XU S, HU X, YANG Y, et al. Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection[J]. Journal of Materials Science:Materials in Electronics. 2014, 25(6):2682-2691.
[2] HUA L, CHAN Y, WU Y, et al. The determination of hexavalent chromium (Cr6+) in electronic and electrical components and products to comply with RoHS regulations[J]. Journal of Hazardous Materials. 2009, 163(2-3):1360-1368.
[3] GUO F, LUCAS J, SUBRAMANIAN K. Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints[J]. Journal of Materials Science:Materials in Electronics, 2001, 12(1):27-35.
[4] XU L, CHEN X, JING H, et al. Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders[J]. Materials Science & Engineering A, 2016, 667:87-96.
[5] JING H, GUO H, WANG L, et al. Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers[J]. Journal of Alloys and Compounds, 2017, 702:669-678.
[6] 张国尚, 荆洪阳, 徐连勇, 等. 纳米压痕法测量80Au/20Sn焊料热力性能[J]. 焊接学报, 2009(9):53-56. ZHANG Guoshang, JING Hongyang, XU Lianyong, et al. Measurement on thermal performance of 80Au/20Sn solder by nanoindentation[J]. Journal of Welding, 2009(9):53-56.
[7] ROSHANGHIAS A, KOKABI A H, MIYASHITA Y, et al. Nanoindentation creep behavior of nanocomposite Sn-Ag-Cu solders[J]. Journal of Electronic Materials, 2012, 41(8):2057-2064.
[8] 孔祥霞,孙凤莲,杨淼森,等. Bi和Ni元素对Cu/SAC/Cu微焊点体钎料蠕变性能的影响[J]. 机械工程学报, 2017, 53(2):53-60. KONG Xiangxia, SUN Fenglian, YANG Miaosen, et al. Effect of Bi and Ni concentration on the creep behavior of the bulks of Cu/SAC/Cu micro solder joints[J]. Journal of Mechanical Engineering, 2017, 53(2):53-60.
[9] KIELY J, HWANG R, HOUSTON J. Effect of surface steps on the plastic threshold in nanoindentation[J]. Physical Review Letters, 1998, 81(20):4424-4427.
[10] 罗勇,葛世荣. Ti6Al4V合金的纳米硬度载荷依赖性实验研究[J]. 清华大学学报, 2007(11):1976-1979. LUO Yong, GE Shirong. Study on nano-hardness load dependence of Ti6Al4V composite alloys[J]. Journal of Tsinghua University, 2007(11):1976-1979.
[11] OLIVER W, PHARR G. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation[J]. Journal of Materials Research, 1992, 7(6):1564-1583.
[12] 蔡晶琦. 单晶铜纳米压痕初始塑性变形行为实验研究[D]. 哈尔滨:哈尔滨工业大学, 2006. CAI Jingqi. Experimental investigations on initial deformation behaviors of single crystal copper in nanoindentation[D]. Harbin:Harbin Institute of Technology, 2006.
[13] HAN Y, JING H, NAI S, et al. Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes[J]. Journal of Materials Science:Materials in Electronics, 2012, 23(5):1108-1115.
[14] OLIVER W, PHARR G. Measurement of hardness and elastic modulus by instrumented indentation:Advances in understanding and refinements to methodology[J]. Journal of Materials Research, 2004, 19(1):3-20.
[15] 王露萌. 双晶材料纳米压痕初始塑性变形行为的跨尺度模拟与实验研究[D]. 哈尔滨:哈尔滨工业大学, 2013. WANG Lumeng. Multiscale simulation and experimental research of initial plastic deformation behavior during nanoindentation of bicrystal material[D]. Harbin:Harbin Institute of Technology, 2013.
[16] MARQUES V, JOHNSTON C, GRANT P. Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1:Young's modulus, hardness and deformation mechanisms as a function of temperature[J]. Acta Materialia, 2013, 61(7):2460-2470.
[17] CORCORAN, COLTON R, LILLEODDEN E, et al. Anomalous plastic deformation at surfaces:Nanoindentation of gold single crystals[J]. Physical Review B, 1997, 551(24):16057-16060.
[18] LORENZ D, ZECKER A, HILPERT U, et al. Pop-in effect as homogeneous nucleation of dislocations during nanoindentation[J]. Physical Review B, 2003, 67(17):386-393.
[19] MASON J, LUND A, SCHUH C. Determining the activation energy and volume for the onset of plasticity during nanoindentation[J]. Physical Review B Condensed Matter, 2006, 73(5):1-14.
[20] 张丽军, 单相高熵合金Al0.3CoCrFeNi纳米压痕蠕变和塑性变形行为研究[D]. 秦皇岛:燕山大学, 2015. ZHANG Lijun, Research on the nanoindentation creep and plastic deformation behavior of the single-phase Al0.3CoCrFeNi high-entropy alloy[D]. Qinhuangdao:Yanshan University, 2015.
[21] SCHUH C A, ARGON A S, NIEH T G, et al. The transition from localized to homogeneous plasticity during nanoindentation of an amorphous metal[J]. Philosophical Magazine, 2003, 83(22):2585-2597.
[22] BOLSHAKOV A, PHARR G. Influences of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques[J]. Journal of Materials Research, 1998, 13(4):1049-1058.
[23] KEESE K, LI Z. Semi-ellipse method for accounting for the pile-up contact area during nanoindentation with the Berkovich indenter[J]. Scripta Materialia, 2006, 55(8):699-702.