Abstract: In order to further enrich and perfect the active disassembly theory, improve disassembly performance and recovery rate of discarded electronic products and recycle effectively all kinds of metal, plastic materials from e-waste. To realize the efficient disassemble and high value recovery of material of at the end of the whole life cycle for electronic products, active disassembly theory based on thermoplastic hot melt adhesive is proposed. Through active disassembly experiment of remote control. Active disassembly time and influence factors are analyzed for its electric heat excitation, air bath excitation and water bath, and then design criteria is proposed. Methods are proposed finally. To achieve one-time fully automatic disassembly in the life cycle of the terminal for electronic products, Product multi-step active disassembly methods are proposed. Validity of design methods are verified by case analysis.

Key words: Active disassembly structure, Connecting element, Failure, Thermoplastic hot melt adhesive