Abstract: Based on the complex function, the analytical stress solution of the board containing an elliptical hole, circle hole and line crack defects can be obtained easily. For an elliptical hole with an edge crack, the mathematical conformal mapping function is too complex to get the precise stress function, so there isn’t the stress distribution in the existing literature. By the complex function and the finite element method, the plane problem of a plate with a crack emanating from an elliptical hole subjected to uniform tension forces is studied. The stress distributions in the vicinity of the hole and the crack are obtained, and compared with the analytical solutions of the elliptical hole or the line crack only. The stress intensity factors(SIF) are also calculated. It is shown that there are obvious stress concentration effects near the hole and the crack tip. The values of stresses reduce to the subjected loads quickly. Because of the interaction of the hole and the crack, the stress values around the elliptic hole and near the crack increase. Comparisons with available analytic results show good coincidence. The stress distribution of an elliptical hole with an edge crack obtained can provide a theoretical basis for engineering design.

Key words: ANSYS, Crack, Elliptical hole, Stress, Stress intensity factor