• CN:11-2187/TH
  • ISSN:0577-6686
无铅微互连焊点力学行为尺寸效应的试验及数值模拟
尹立孟;张新平
Experiment and Numerical Simulation of Size Effects of Mechanical Behaviors of Lead-free Micro-interconnection Solder Joints
YIN Limeng;ZHANG Xinping
. 2010, (2): 55 -60 .