• CN:11-2187/TH
  • ISSN:0577-6686
镦粗过程中孔洞应变分布的光塑性研究
任广升;黄朝晖;白志斌
EXPERIMENTAL INVESTIGATION OF STRAIN DISTRIBUTION IN CYLINDER MODEL WITH VOID IN THE CENTER DURING UPSET PROCESSES BY PHOTOPLASTIC SIMULATION
Ren Guangsheng;Huang Zhaohui;Bai Zhibin
. 1995, (2): 93 -98 .