• CN:11-2187/TH
  • ISSN:0577-6686
考虑弯曲效应的混元胶接单搭接头应力模型
赵波
Theoretical Stress Model of Mixed-modulus Single-lap Adhesive Bonded Joints Considering the Bending Effect
ZHAO Bo
. 2008, (10): 129 -137 .