化学机械抛光中Si/Cu/Ta/low-k界面剥离和断裂特性研究

杜诗文;李永堂

Delamination and Fracture Characteristic Study of Si/Cu/Ta/low-k System during Chemical Mechanical Polishing

DU Shiwen;LI Yongtang

. 2012, (4): 26 -31 .