基于VMD-共振频带-能量熵的倒装焊芯片缺陷检测方法
李可, 于成昊, 明雪飞, 顾杰斐, 宿磊, MICHAEL Pecht
Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy
LI Ke, YU Chenghao, MING Xuefei, GU Jiefei, SU Lei, MICHAEL Pecht
机械工程学报
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2025, (10): 250
-262
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DOI: 10.3901/JME.2025.10.250
