• CN:11-2187/TH
  • ISSN:0577-6686
绝缘封装用碳化硅颗粒掺杂的非线性电导复合材料设计要素研究
孙凯兵, 李欣, 梅云辉
Design Features of Silicon Carbide-doped Nonlinear Conductive Composites for Insulating Packages
SUN Kaibing, LI Xin, MEI Yunhui
机械工程学报 . 2025, (2): 97 -105 .  DOI: 10.3901/JME.2025.02.097