基于机器学习电子封装互连材料研究现状
张墅野, 段晓康, 罗克宇, 许孙武, 张志昊, 陈捷狮, 何鹏
Current Status of Electronic Packaging Materials Using Machine Learning
ZHANG Shuye, DUAN Xiaokang, LUO Keyu, XU Sunwu, ZHANG Zhihao, CHEN Jieshi, HE Peng
机械工程学报
.
2023, (22): 222
-233
.
DOI: 10.3901/JME.2023.22.222
