• CN:11-2187/TH
  • ISSN:0577-6686
电-热-力耦合载荷下非均匀组织Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究
李望云, 李兴民, 汪健, 梁泾洋, 秦红波
Tensile Performance of Inhomogeneous Microscale Cu/Sn-58Bi/Cu Solder Joints under Electro-thermo-mechanical Coupled Loads
LI Wangyun, LI Xingmin, WANG Jian, LIANG Jingyang, QIN Hongbo
机械工程学报 . 2022, (2): 307 -320 .  DOI: 10.3901/JME.2022.02.307