电子封装跨尺度凸点结构Sn3.0Ag0.5Cu/Cu微互连焊点界面IMC生长与演化及力学行为的尺寸效应
周敏波, 赵星飞, 陈明强, 柯常波, 张新平
Size Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages
ZHOU Minbo, ZHAO Xingfei, CHEN Mingqiang, KE Changbo, ZHANG Xinping
机械工程学报
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2022, (2): 259
-268
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DOI: 10.3901/JME.2022.02.259
