纳米银微焊点阵列的超快激光图形化沉积及其芯片封装研究
吴永超, 王帅奇, 郭伟, 刘磊, 邹贵生, 彭鹏
Patterning Deposition of Nano-sliver Micro Bumps Array by Ultrafast Laser and Its Chip Packaging Research
WU Yongchao, WANG Shuaiqi, GUO Wei, LIU Lei, ZOU Guisheng, PENG Peng
机械工程学报
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2022, (2): 166
-175
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DOI: 10.3901/JME.2022.02.166
