芯片互连层化学机械平坦化过程中材料移除机理研究进展
杭弢, 常鹏飞, 李明
Research Progress of Material Removal Mechanism in Chemical Mechanical Planarization for Metal Interconnection Layer of Chips
HANG Tao, CHANG Pengfei, LI Ming
机械工程学报
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2022, (2): 147
-158
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DOI: 10.3901/JME.2022.02.147
